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Ceramic Bond Diamond grinding wheel

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Classification:

Diamond grinding wheel

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产品描述

- Commodity name: Ceramic Bond Diamond grinding wheel
- Commodity ID: 1062290428104691712
　1） Product Introduction
　　Ceramic bond diamond grinding wheel features high strength, good heat resistance, excellent sharpness, and high cutting efficiency, will not produce heat or blocking easily during grinding, the thermal expansion amount is small and it is easy to control the machining accuracy. Compared with resin binder, diamond grinding wheel solves the problems of low service life, low grinding efficiency and easy deformation of grinders during grinding and cutting. Therefore, ceramic bond has a more and more obvious advantage in the abrasive machining of ceramic and some special materials and enjoys good prospects during the development of diamond grinding wheels. High-performance grinding wheels with the features of high speed, high efficiency, high precision, low grinding and cutting costs and low environmental pollution are more and more widely applied. It is the hot product that grinding tool manufacturers compete to develop in different countries in the world.

　　2） Features and Advantages
　　1. High grinding efficiency;
　　2. With very high abrasion resistance: Grinding wheels feature high abrasion resistance and abrasive particles, which are especially obvious when grinding hard and brittle workpieces;
　　3. Small grinding force and low grinding temperature;
　　4. Workpieces ground have a high precision, good surface quality and the workpiece shape remain good.

　　3） Application Scope
　　Ceramic bond diamond grinding wheels are mainly used in the machining of wafers (semiconductor silicon and solar wafers), diamond compact, polycrystalline diamond, diamond tools, CBN (cubic boron nitride), tungsten steel (cemented carbide), new engineering structural ceramics, precious stones, crystal, rare earth materials (magnetic material) and other highly hard and brittle materials. Ceramic bond diamond grinding wheels with good toughness are used for the rough and finished grinding of TV electric image tube fluorescent screens. Using ceramic bond diamond grinding wheel to process high performance silicon wafers for integrated circuits (IC) features high machining precision, low machining roughness, no metal ion pollution to the silicon wafer after grinding, and high percent of product acceptability.

　　4） Customer Information
　　Packaging: 1piece/box
　　Date of Delivery: Determined by the customers’ purchase quantity
　　Delivery Method: By DHL,UPS,FedEx.etc
　　Payment: T/T 100%
　　MOQ: 10 pieces
　　About Sending Samples: The customerwill afford for sample fee and freight

No.

Electroplated Diamond grinding wheel

No.

Electroplated Diamond grinding wheel

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